![Imagen1](https://storage.googleapis.com/wp-uploads.bucket.wp.uc3m.es/wp-content/uploads/sites/42/2024/02/12113607/Imagen1.png)
The LSI, together with other UC3M researchers, participates in the project “Advanced Test, Assembly and Packaging Technologies for Integrated Electronic and Photonic Circuits – EPICPack”, funded by the ‘Cátedras Chip’ programme within the framework of the Microelectronics and Semiconductors Strategic Project (PERTE Chip) with 3 million euros. Congratulations team! We have a fantastic challenge.